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EPM240T100C3 - Intel

Description: CPLD - Complex Programmable Logic Devices The factory is currently not accepting orders for this product.

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EPM240T100C3 - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin TQFP - Wire Bond - A:1.20
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EPM240T100C3 - Intel  - 3D model - Quad Flat Packages - 100-Pin TQFP - Wire Bond - A:1.20
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EPM240T100C3 Details

  • Manufacturer Part Number:

    EPM240T100C3

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    80

  • Number of Inputs:

    80

  • Number of Macro Cells:

    192

  • Number of Outputs:

    80

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 80 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    4.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL EXTENDED

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    14 mm

EPM240T100C3 Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the EPM240T100C3, which includes recommendations for PCB layout, thermal management, and power delivery. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • Intel recommends using the JTAG (Joint Test Action Group) interface for configuration and programming. You can use Intel's Quartus II software or third-party tools like UrJTAG to implement a reliable interface. Make sure to follow the datasheet guidelines for JTAG pin connections and signal integrity.
  • The EPM240T100C3 requires a specific power-up and power-down sequencing to ensure proper operation. Intel recommends powering up the device in the following order: VCCINT, VCCIO, and then VREF. During power-down, the sequence should be reversed. Refer to the datasheet for specific voltage and timing requirements.
  • To ensure signal integrity and reduce EMI, follow Intel's guidelines for signal routing, termination, and shielding. Use differential signaling, keep clock lines short, and avoid routing signals near the device's I/O pins. Additionally, use a solid ground plane and consider using EMI filters or shielding to reduce radiation.
  • The EPM240T100C3 is rated for commercial temperature operation (0°C to 70°C) and industrial temperature operation (-40°C to 100°C). Ensure your design operates within these temperature ranges and follows the recommended storage and handling guidelines to prevent damage.

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EPM240T100C3 Overview

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Part Image EPM240T100C3 Altera Corporation

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Part Image EPM240T100A3 Intel Corporation

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Part Image EPM240T100I3 Altera Corporation

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For a full list of alternate parts for EPM240T100C3, check out Findchips.com