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EPM240ZM100I8N - Intel

Description: CPLD - Complex Programmable Logic Devices CPLD - MAX II 192 Macro 80 IOs

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EPM240ZM100I8N - Intel PCB footprint - BGA - BGA - 100MBGA
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EPM240ZM100I8N - Intel  - 3D model - BGA - 100MBGA
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EPM240ZM100I8N Details

  • Manufacturer Part Number:

    EPM240ZM100I8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    BGA-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.7

  • Clock Frequency-Max:

    113.6 MHz

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • Length:

    6 mm

  • Number of I/O Lines:

    80

  • Number of Inputs:

    80

  • Number of Macro Cells:

    192

  • Number of Outputs:

    80

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    80 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFBGA

  • Package Equivalence Code:

    BGA100,11X11,20

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, THIN PROFILE, FINE PITCH

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    14 ns

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    6 mm

EPM240ZM100I8N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the EPM240ZM100I8N, which includes recommendations for PCB layout, thermal management, and power delivery. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • The EPM240ZM100I8N can be configured and programmed using Intel's Quartus II software or the Intel FPGA Software Development Kit (SDK). These tools provide a comprehensive development environment for designing, testing, and deploying FPGA-based systems.
  • The power consumption of the EPM240ZM100I8N depends on the specific application and usage. Intel provides power estimation tools and guidelines to help designers estimate power consumption. The thermal characteristics, such as junction temperature and thermal resistance, are also specified in the datasheet and application notes.
  • Signal integrity and noise reduction are critical in high-speed digital designs. Intel provides guidelines and recommendations for signal integrity, including PCB layout, routing, and termination techniques. Additionally, the EPM240ZM100I8N has built-in features, such as input/output buffers and clock conditioning circuits, to help reduce noise and improve signal quality.
  • The EPM240ZM100I8N is designed to meet specific radiation and environmental requirements, such as temperature range, humidity, and vibration. Intel provides detailed specifications and guidelines for environmental testing and qualification in the datasheet and application notes.

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EPM240ZM100I8N Overview

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