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EPM3064ATC44-7N - Intel

Description: Programmable Logic Device Family

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EPM3064ATC44-7N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 44-TQFP
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EPM3064ATC44-7N - Intel  - 3D model - Quad Flat Packages - 44-TQFP
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EPM3064ATC44-7N Details

  • Manufacturer Part Number:

    EPM3064ATC44-7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-44

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    135.1 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G44

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    10 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    30

  • Number of Inputs:

    34

  • Number of Macro Cells:

    64

  • Number of Outputs:

    10

  • Number of Terminals:

    44

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 30 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LQFP

  • Package Equivalence Code:

    TQFP44,.47SQ,32

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.27 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.8 mm

  • Terminal Position:

    QUAD

  • Width:

    10 mm

EPM3064ATC44-7N Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and minimizing the distance between the device and the heat sink. Intel provides a reference design guide for PCB layout.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which provides a reset signal to the EPM3064ATC44-7N during power-up. The voltage supervisor IC should be connected to the VCC pin of the EPM3064ATC44-7N.
  • When selecting a clock source for the EPM3064ATC44-7N, consider the frequency accuracy, jitter, and phase noise requirements. A crystal oscillator or a high-quality clock generator IC, such as the CY22050, can be used as a clock source. Ensure the clock source meets the EPM3064ATC44-7N's clock input requirements.
  • To ensure reliable configuration data storage and retrieval, use a high-reliability configuration memory device, such as the EPCS16SI16N, which is specifically designed for use with Intel FPGAs. Follow Intel's guidelines for configuration data storage and retrieval to ensure data integrity.
  • Thermal management considerations for the EPM3064ATC44-7N include providing adequate airflow, using a heat sink with a thermal interface material, and ensuring proper PCB layout for heat dissipation. Intel provides thermal management guidelines and thermal models for the EPM3064ATC44-7N.

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EPM3064ATC44-7N Overview

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Part Image EPM3064ATC44-7 Intel Corporation

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