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EPM3128ATC144-10 - Intel

Description: CPLD MAX® 3000A Family 2.5K Gates 128 Macro Cells 98MHz 3.3V 144-Pin TQFP Tray

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EPM3128ATC144-10 - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM3128ATC144-10 - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM3128ATC144-10 Details

  • Manufacturer Part Number:

    EPM3128ATC144-10

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    98 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    92

  • Number of Inputs:

    96

  • Number of Macro Cells:

    128

  • Number of Outputs:

    92

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 92 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EPM3128ATC144-10 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended for optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • Use the Intel Quartus Prime software to program and configure the FPGA. Ensure that the device is properly powered and clocked before programming, and follow the recommended programming sequence outlined in the datasheet.
  • The power supplies should be sequenced in the following order: VCCINT, VCCA, VCCIO. The power supplies should be ramped up slowly to prevent damage to the device.
  • Handle the device by the body, not the pins. Store the device in an anti-static bag or wrap it in anti-static material to prevent electrostatic discharge (ESD) damage.
  • The device operates in a temperature range of 0°C to 85°C, with a maximum junction temperature of 100°C. The recommended operating voltage is 1.8V, with a tolerance of ±10%.

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EPM3128ATC144-10 Overview

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Part Image EPM3128ATC144-10 Altera Corporation

EE PLD, 10ns, 128-Cell, CMOS, PQFP144

Part Image EPM3128ATC144-10N Intel Corporation

EE PLD, 10ns, 128-Cell, CMOS, PQFP144