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EPM3256AFC256-7 - Intel

Description: IC CPLD 256MC 7.5NS 256FBGA

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PCB Footprints
EPM3256AFC256-7 - Intel PCB footprint - BGA - BGA - 256-FBGA (17x17) (option1)
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3D Models
EPM3256AFC256-7 - Intel  - 3D model - BGA - 256-FBGA (17x17) (option1)
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EPM3256AFC256-7 Details

  • Manufacturer Part Number:

    EPM3256AFC256-7

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FINE LINE, BGA-256

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    126.6 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    157

  • Number of Inputs:

    161

  • Number of Macro Cells:

    256

  • Number of Outputs:

    157

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 161 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

EPM3256AFC256-7 Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for PCB layout and thermal management in the Cyclone II FPGA Development Kit User Guide. It's recommended to follow the guidelines for optimal performance and thermal dissipation.
  • Intel provides guidelines for CDC in the Cyclone II FPGA Clock Domain Crossing User Guide. It's recommended to use synchronous clock domains, use clock enable signals, and implement CDC using Intel's recommended IP cores or user-written logic.
  • The maximum operating temperature range for EPM3256AFC256-7 is -40°C to 100°C, as specified in the datasheet. However, it's recommended to operate the device within the commercial temperature range of 0°C to 85°C for optimal performance and reliability.
  • Intel provides power optimization guidelines in the Cyclone II FPGA Power Management User Guide. Techniques include using low-power modes, reducing clock frequencies, and optimizing logic usage. Additionally, using Intel's PowerPlay power analysis tool can help identify areas for power optimization.
  • Intel recommends using the Quartus II software for programming and configuring EPM3256AFC256-7. The software provides a user-friendly interface for designing, compiling, and programming the FPGA. Additionally, Intel provides a range of programming cables and adapters for in-system programming and configuration.

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EPM3256AFC256-7 Overview

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Part Image EPM3256AFC256-7 Altera Corporation

EE PLD, 7.5ns, 256-Cell, CMOS, PBGA256

Part Image EPM3256AFC256-7N Altera Corporation

EE PLD, 7.5ns, 256-Cell, CMOS, PBGA256