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EPM3256ATC144-10 - Intel

Description: IC, Programmable, Logic, 3.3V, ISP, EEPROM, 256 Macrocells, 144 pin TQFP, 10ns, EPM3256ATC14410

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PCB Footprints
EPM3256ATC144-10 - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144 pin TQFP
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EPM3256ATC144-10 - Intel  - 3D model - Quad Flat Packages - 144 pin TQFP
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EPM3256ATC144-10 Details

  • Manufacturer Part Number:

    EPM3256ATC144-10

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    95.2 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    112

  • Number of Inputs:

    116

  • Number of Macro Cells:

    256

  • Number of Outputs:

    112

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 112 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EPM3256ATC144-10 Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and minimizing the distance between the device and the thermal vias. Intel provides a reference design guide for PCB layout.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which can detect the power supply voltage and generate a reset signal when the voltage is below a certain threshold.
  • When selecting a clock source, consider the frequency accuracy, jitter, and phase noise requirements of the application. The EPM3256ATC144-10 can use an internal oscillator or an external clock source, and the clock source should be chosen based on the specific application requirements.
  • To ensure reliable configuration, use a configuration device, such as the EPCS16, which can store the configuration data and provide a reliable power-up sequence. Additionally, implement a power-on reset (POR) circuit to ensure a clean power-up sequence.
  • When implementing a JTAG interface, consider the signal integrity, voltage levels, and termination requirements. Use a JTAG connector that meets the IEEE 1149.1 standard, and ensure that the JTAG signals are properly terminated to prevent signal reflections.

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EPM3256ATC144-10 Overview

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