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EPM3256ATC144-10N - Intel

Description: ALTERA - EPM3256ATC144-10N - CPLD, MAX 3000A Series, EEPROM, 256, 116 I/O's, TQFP, 144 Pins, 95.2 MHz

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PCB Footprints
EPM3256ATC144-10N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM3256ATC144-10N - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM3256ATC144-10N Details

  • Manufacturer Part Number:

    EPM3256ATC144-10N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    95.2 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    112

  • Number of Inputs:

    116

  • Number of Macro Cells:

    256

  • Number of Outputs:

    112

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 112 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EPM3256ATC144-10N Frequently Asked Questions (FAQs)

  • The recommended PCB layout for optimal thermal performance involves placing thermal vias under the device, using a solid ground plane, and minimizing the distance between the device and the heat sink. Intel provides a reference design guide for PCB layout.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which monitors the power supply voltage and asserts a reset signal to the FPGA during power-up or brownout conditions.
  • When selecting a clock source, consider the frequency range, jitter, and phase noise requirements of the application. Intel recommends using a clock source with a frequency range of 10-100 MHz, and a jitter of less than 100 ps.
  • To ensure signal integrity and minimize EMI, use controlled impedance traces, route critical signals away from noise sources, and implement proper termination and shielding techniques. Intel provides guidelines for signal integrity and EMI mitigation in their application notes.
  • To implement a reliable JTAG interface, use a dedicated JTAG clock pin, ensure proper termination and signal routing, and follow Intel's guidelines for JTAG interface design and testing.

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EPM3256ATC144-10N Overview

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Part Image EPM3256ATC144-10N Altera Corporation

EE PLD, 10ns, 256-Cell, CMOS, PQFP144

Part Image EPM3256ATC144-10 Altera Corporation

EE PLD, 10ns, 256-Cell, CMOS, PQFP144

Part Image EPM3256ATI144-10N Altera Corporation

EE PLD, 10ns, 256-Cell, CMOS, PQFP144

Part Image EPM3256ATI144-10 Intel Corporation

EE PLD, 10ns, 256-Cell, CMOS, PQFP144

Part Image EPM3256ATI144-10N Intel Corporation

EE PLD, 10ns, 256-Cell, CMOS, PQFP144

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