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EPM3512AFC256-7 - Intel

Description: CPLD - Complex Programmable Logic Devices CPLD - MAX 3000A 512 Macro 208 IOs

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EPM3512AFC256-7 - Intel PCB footprint - BGA - BGA - 256-FBGA (17x17) (option1)
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EPM3512AFC256-7 - Intel  - 3D model - BGA - 256-FBGA (17x17) (option1)
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EPM3512AFC256-7 Details

  • Manufacturer Part Number:

    EPM3512AFC256-7

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FINE LINE, BGA-256

  • ECCN Code:

    3A991.d

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    97.08 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    208

  • Number of Inputs:

    208

  • Number of Macro Cells:

    512

  • Number of Outputs:

    204

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 204 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    17 mm

EPM3512AFC256-7 Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for PCB layout and thermal management in the Cyclone III FPGA Development Kit documentation. It's recommended to follow these guidelines to ensure optimal performance and thermal dissipation.
  • Intel recommends using a POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The POR circuit should be designed to meet the FPGA's power-up requirements, including the voltage ramp rate and power-on reset timing.
  • For high-speed interfaces like PCIe, SATA, and DDR, it's essential to follow Intel's signal integrity guidelines, including using controlled impedance traces, minimizing signal reflections, and using termination resistors. Additionally, routing these signals on inner layers and using shielding vias can help reduce electromagnetic interference (EMI).
  • To optimize power consumption, use Intel's PowerPlay Early Power Estimator (EPE) tool to estimate power consumption based on your design's specific requirements. Then, implement power-saving techniques like clock gating, dynamic voltage and frequency scaling, and using low-power modes when possible.
  • To secure configuration data, use Intel's FPGA-based security features, such as the Advanced Encryption Standard (AES) and the Secure Hash Algorithm (SHA). Additionally, implement secure boot mechanisms, like authenticated boot, and use encryption for configuration data storage.

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EPM3512AFC256-7 Overview

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Part Image EPM3512AFC256-7N Altera Corporation

EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256