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EPM570F100I5N - Intel

Description: CPLD - Complex Programmable Logic Devices CPLD - MAX II 440 Macro 76 IOs

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EPM570F100I5N - Intel PCB footprint - BGA - BGA - 100 pin fbga
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EPM570F100I5N Details

  • Manufacturer Part Number:

    EPM570F100I5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    175.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    76

  • Number of Inputs:

    76

  • Number of Macro Cells:

    440

  • Number of Outputs:

    76

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 76 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA100,10X10,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

EPM570F100I5N Frequently Asked Questions (FAQs)

  • The recommended power-up sequence is to apply VCCINT first, followed by VCCIO, and then configure the device. This ensures that the internal voltage regulators are powered up correctly.
  • To implement a reliable clock tree, use the dedicated clock networks (GCLK) and follow Intel's guidelines for clock tree design, including using a single clock source, minimizing clock skew, and using clock enable signals to control clock domains.
  • The EPM570F100I5N has limited internal memory (M4K blocks), which can be a limitation for designs that require large amounts of memory. Consider using external memory or optimizing your design to minimize memory usage.
  • To optimize power consumption, use Intel's PowerPlay power analysis tool, enable power-saving features like clock gating and dynamic voltage frequency scaling, and optimize your design's clock frequency and voltage.
  • The EPM570F100I5N has a maximum junction temperature of 100°C. Ensure good thermal conductivity between the device and the PCB, use thermal vias, and consider using a heat sink or thermal interface material to manage heat dissipation.

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EPM570F100I5N Overview

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