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EPM570GF100C5N - Intel

Description: CPLD - Complex Programmable Logic Devices

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EPM570GF100C5N - Intel PCB footprint - BGA - BGA - 100-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55-1
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EPM570GF100C5N - Intel  - 3D model - BGA - 100-Pin FineLine Ball-Grid Array (FBGA) - THIN - Wire Bond - A:1.55-1
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EPM570GF100C5N Details

  • Manufacturer Part Number:

    EPM570GF100C5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    FBGA-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.7

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    175.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B100

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    11 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    76

  • Number of Inputs:

    76

  • Number of Macro Cells:

    440

  • Number of Outputs:

    76

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS, 76 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LBGA

  • Package Equivalence Code:

    BGA100,10X10,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY, LOW PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    11 mm

EPM570GF100C5N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-6 layer PCB stackup with a dedicated power plane, and a signal layer with a minimum of 10 mils of spacing between signals. A detailed layout guide is available in the Intel FPGA PCB Design Guidelines document.
  • Use a reliable configuration source such as a flash memory device, and ensure that the configuration clock (CCLK) is stable and within the recommended frequency range. Also, implement a robust configuration monitoring and error detection mechanism.
  • The EPM570GF100C5N has a maximum junction temperature of 100°C. Ensure good airflow around the device, and consider using a heat sink or thermal interface material to reduce thermal resistance. Monitor the device temperature using the built-in thermal diode.
  • Use the Intel PowerPlay power analysis tool to identify power-hungry components and optimize clock frequencies, voltage, and toggle rates. Implement power gating and dynamic voltage and frequency scaling (DVFS) where possible.
  • Follow Intel's EMI and EMC guidelines, including using a solid ground plane, minimizing signal loop areas, and using EMI filters and shielding where necessary. Ensure compliance with relevant regulatory standards such as FCC and CE.

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EPM570GF100C5N Overview

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EPM570GF100C5N Alternates

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Image Part Number Model
Part Image EPM570GF100I5N Altera Corporation

Flash PLD, 8.7ns, 440-Cell, CMOS, PBGA100

Part Image EPM570GF100A5N Intel Corporation

Flash PLD, 8.7ns, 440-Cell, CMOS, PBGA100

Part Image EPM570GF100I5N Intel Corporation

Flash PLD, 8.7ns, 440-Cell, CMOS, PBGA100

Part Image EPM570GF100C5N Altera Corporation

Flash PLD, 8.7ns, 440-Cell, CMOS, PBGA100

Part Image EPM570GF100A5N Altera Corporation

Flash PLD, 8.7ns, 440-Cell, CMOS, PBGA100

For a full list of alternate parts for EPM570GF100C5N, check out Findchips.com