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EPM570T144I5N - Intel

Description: CPLD, MAX II IC CPLD 440MC 5.4NS 144TQFP

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EPM570T144I5N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM570T144I5N - Intel  - 3D model - Quad Flat Packages - 144-Pin Plastic Thin Quad Flat Pack (TQFP) - Wire Bond - A:1.60
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EPM570T144I5N Details

  • Manufacturer Part Number:

    EPM570T144I5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TQFP-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    175.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    116

  • Number of Inputs:

    116

  • Number of Macro Cells:

    440

  • Number of Outputs:

    116

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 116 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.87SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    20 mm

EPM570T144I5N Frequently Asked Questions (FAQs)

  • Intel provides a PCB layout and routing guide for the EPM570T144I5N in the 'Cyclone V Device Family Pin Connection Guidelines' document. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the TLV7031, which can detect the power supply voltage and generate a reset signal for the FPGA. The POR circuit should be designed to ensure that the FPGA is properly reset during power-up and power-down sequences.
  • The EPM570T144I5N has a maximum junction temperature (TJ) of 100°C. To ensure reliable operation, it's essential to implement proper thermal management, including heat sinks, thermal interfaces, and airflow management. Intel provides thermal management guidelines in the 'Cyclone V Device Family Thermal Management' document.
  • To optimize the EPM570T144I5N for low power consumption, use the Intel Quartus Prime software to enable power-saving features, such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. Additionally, optimize the design to minimize switching activity, use low-power IP cores, and consider using the FPGA's built-in power management features.
  • To implement a reliable JTAG interface, ensure that the JTAG signals are properly terminated, and the JTAG clock frequency is within the recommended range (typically 6-33 MHz). Additionally, use a JTAG cable with a 1:1 ratio and ensure that the JTAG voltage is within the recommended range (typically 1.8V to 3.3V).

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EPM570T144I5N Overview

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Part Image EPM570T144A5N Altera Corporation

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Part Image EPM570T144I5 Altera Corporation

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Part Image EPM570T144C5 Intel Corporation

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Part Image EPM570T144A5 Altera Corporation

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