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EPM570ZM144C7N - Intel

Description: IC CPLD 440MC 9NS 144MBGA

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EPM570ZM144C7N - Intel PCB footprint - BGA - BGA - 144-Pin Micro FineLine Ball-Grid Array (MBGA)
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EPM570ZM144C7N - Intel  - 3D model - BGA - 144-Pin Micro FineLine Ball-Grid Array (MBGA)
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EPM570ZM144C7N Details

  • Manufacturer Part Number:

    EPM570ZM144C7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    MBGA-144

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.7

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    112.3 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    R-PBGA-B144

  • JESD-609 Code:

    e1

  • JTAG BST:

    YES

  • Length:

    7 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    116

  • Number of Inputs:

    116

  • Number of Macro Cells:

    440

  • Number of Outputs:

    116

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    85 °C

  • Organization:

    0 DEDICATED INPUTS

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA144,13X13,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    15.1 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    1.89 V

  • Supply Voltage-Min:

    1.71 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    BOTTOM

  • Width:

    7 mm

EPM570ZM144C7N Frequently Asked Questions (FAQs)

  • Intel provides a Power and Thermal Management Guide for Cyclone III FPGAs, which includes guidelines for PCB layout, thermal management, and heat sink design. Additionally, Intel's Quartus II software provides a Power Play Early Power Estimator (EPE) tool to estimate power consumption and thermal performance.
  • Intel recommends following the guidelines in the Cyclone III FPGA Device Family Pin Connection Guidelines and the High-Speed Board Design Guidelines. Additionally, using Intel's Signal Integrity Tool (SIT) can help optimize signal routing and reduce EMI.
  • The EPM570ZM144C7N can be configured using Intel's Quartus II software, which supports various configuration modes, including JTAG, AS, and PS mode. The FPGA can also be programmed using external memory devices, such as flash memory or EEPROM.
  • Intel provides a Clock Domain Crossing (CDC) User Guide, which explains how to implement CDC in Cyclone III FPGAs. Additionally, the Quartus II software provides a Clock Wizard tool to help manage clock domains and implement clock management logic.
  • The EPM570ZM144C7N has built-in features for reliability and availability, including error detection and correction (EDC), single-event upset (SEU) mitigation, and built-in self-test (BIST). Intel also provides a Reliability and Availability Guide for Cyclone III FPGAs, which provides more information on these features.

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EPM570ZM144C7N Overview

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Part Image EPM570ZM144I7N Intel Corporation

Flash PLD, 15.1ns, 440-Cell, CMOS, PBGA144

Part Image EPM570ZM144A7N Intel Corporation

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Part Image EPM570ZM144A7N Altera Corporation

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Part Image EPM570ZM144I7N Altera Corporation

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Part Image EPM570ZM144C7N Altera Corporation

Flash PLD, 15.1ns, 440-Cell, CMOS, PBGA144

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