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EPM7128SQC160-10N - Intel

Description: CPLD MAX® 7000 Family 2.5K Gates 128 Macro Cells 100MHz 5V 160-Pin PQFP Tray

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EPM7128SQC160-10N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 160-Pin Plastic Quad Flat Pack (PQFP)
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EPM7128SQC160-10N - Intel  - 3D model - Quad Flat Packages - 160-Pin Plastic Quad Flat Pack (PQFP)
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EPM7128SQC160-10N Details

  • Manufacturer Part Number:

    EPM7128SQC160-10N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, QFP-160

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

  • Clock Frequency-Max:

    125 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G160

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    100

  • Number of Inputs:

    100

  • Number of Macro Cells:

    128

  • Number of Outputs:

    100

  • Number of Terminals:

    160

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 100 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP160,1.2SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    10 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.07 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

EPM7128SQC160-10N Frequently Asked Questions (FAQs)

  • Intel recommends following the guidelines in the 'Intel FPGA Power Management and Thermal Management' document (available on the Intel website) for optimal PCB layout and thermal management. This includes using a 4-layer PCB with a solid ground plane, placing decoupling capacitors near the device, and using thermal vias to dissipate heat.
  • Intel provides guidelines for clock domain crossing in the 'Intel FPGA Clock Domain Crossing (CDC) Design Guide' (available on the Intel website). This includes using synchronizers, FIFOs, and other CDC techniques to ensure data integrity across clock domains.
  • Intel recommends following the guidelines in the 'Intel FPGA Reliability and Availability' document (available on the Intel website) for high-reliability and safety-critical applications. This includes using error correction codes, implementing redundancy, and following strict design and verification procedures.
  • Intel recommends using the 'Intel FPGA Power Estimator' tool to estimate power consumption and identify areas for optimization. Techniques for low power consumption include using clock gating, reducing toggle rates, and optimizing the device's voltage and frequency settings.
  • The EPM7128SQC160-10N is supported by Intel's Quartus Prime Design Software, which provides a comprehensive development environment for FPGA design, synthesis, and implementation. Other supported tools include the Intel FPGA SDK for OpenCL and the Intel SoC FPGA Embedded Development Suite (EDS).

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EPM7128SQC160-10N Overview

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Part Image EPM7128SQC160-10 Altera Corporation

EE PLD, 10ns, 128-Cell, CMOS, PQFP160

Part Image EPM7128SQC160-10N Altera Corporation

EE PLD, 10ns, 128-Cell, CMOS, PQFP160