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EPM7160SQC160-7 - Intel

Description: CPLD MAX® 7000S Family 3.2K Gates 160 Macro Cells 122MHz 5V 160-Pin PQFP Tray

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EPM7160SQC160-7 - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 160-Pin Plastic Quad Flat Pack (PQFP)
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EPM7160SQC160-7 - Intel  - 3D model - Quad Flat Packages - 160-Pin Plastic Quad Flat Pack (PQFP)
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EPM7160SQC160-7 Details

  • Manufacturer Part Number:

    EPM7160SQC160-7

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, QFP-160

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V

  • Clock Frequency-Max:

    166.7 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G160

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    104

  • Number of Inputs:

    104

  • Number of Macro Cells:

    160

  • Number of Outputs:

    104

  • Number of Terminals:

    160

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 104 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    QFP

  • Package Equivalence Code:

    QFP160,1.2SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.07 mm

  • Supply Voltage-Max:

    5.25 V

  • Supply Voltage-Min:

    4.75 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

EPM7160SQC160-7 Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for the EPM7160SQC160-7, which includes recommendations for PCB layout, thermal management, and power delivery. It's essential to follow these guidelines to ensure optimal performance and reliability.
  • Intel recommends using a clock tree architecture with a central clock source and distributing clock signals to each component. Termination should be done using a series resistor and capacitor (R-C) network to minimize signal reflections and ensure signal integrity.
  • The EPM7160SQC160-7 requires a specific power-up and power-down sequencing to ensure proper operation. Intel recommends powering up the core voltage (VCC) before the input/output voltage (VCCIO) and powering down the VCCIO before the VCC. A power sequencing controller or a dedicated power management IC can be used to implement this sequencing.
  • The EPM7160SQC160-7 supports JTAG boundary scan and debugging through the IEEE 1149.1 standard. Intel provides a JTAG interface description and boundary scan description language (BSDL) files for the device. Engineers can use third-party tools, such as Altera's Quartus II or Intel's FPGA development software, to implement JTAG boundary scan and debugging.
  • The EPM7160SQC160-7 is designed to meet certain radiation and EMI requirements, but engineers should still take precautions to ensure the device operates reliably in their specific application. This includes following Intel's guidelines for radiation-hardened design, using EMI shielding and filtering, and implementing proper PCB layout and grounding techniques.

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EPM7160SQC160-7 Overview

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Part Image EPM7160SQC160-7 Altera Corporation

EE PLD, 7.5ns, 160-Cell, CMOS, PQFP160

Part Image EPM7160SQC160-7N Intel Corporation

EE PLD, 7.5ns, 160-Cell, CMOS, PQFP160