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EPM7256AETC144-5N - Intel

Description: CPLD MAX® 7000A Family 5K Gates 256 Macro Cells 172.4MHz 3.3V 144-Pin TQFP Tray

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EPM7256AETC144-5N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 144 pin TQFP
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EPM7256AETC144-5N - Intel  - 3D model - Quad Flat Packages - 144 pin TQFP
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EPM7256AETC144-5N Details

  • Manufacturer Part Number:

    EPM7256AETC144-5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TQFP-144

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    172.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G144

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    20 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    120

  • Number of Inputs:

    124

  • Number of Macro Cells:

    256

  • Number of Outputs:

    120

  • Number of Terminals:

    144

  • Operating Temperature-Max:

    70 °C

  • Organization:

    4 DEDICATED INPUTS, 120 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LFQFP

  • Package Equivalence Code:

    QFP144,.63SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, LOW PROFILE, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    5.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.6 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    20 mm

EPM7256AETC144-5N Frequently Asked Questions (FAQs)

  • Intel provides a reference design guide for PCB layout and thermal management in the 'EPM7256AETC144-5N Design Guide' document, which can be found on the Intel website. It's essential to follow these guidelines to ensure proper heat dissipation and signal integrity.
  • Intel recommends using an external POR circuit with a voltage supervisor IC, such as the MAX809, to ensure a reliable power-on reset. The POR circuit should be designed to meet the device's power-up requirements, as specified in the datasheet.
  • The EPM7256AETC144-5N supports JTAG boundary scan testing, but it's essential to follow Intel's guidelines for JTAG testing, as outlined in the 'EPM7256AETC144-5N JTAG Boundary Scan' document. This includes using the correct JTAG interface and adhering to the recommended testing procedures.
  • To ensure EMC, it's crucial to follow Intel's guidelines for PCB layout, component selection, and shielding. Additionally, the device should be used in a system that meets the relevant EMC standards, such as IEC 61000-4-x. Intel provides EMC design guidelines in the 'EPM7256AETC144-5N EMC Design Guide' document.
  • For high-reliability or safety-critical applications, it's essential to follow Intel's guidelines for device selection, PCB design, and testing. Additionally, the device should be used within its recommended operating conditions, and the system should be designed to meet the relevant safety standards, such as IEC 61508 or DO-254.

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EPM7256AETC144-5N Overview

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Part Image EPM7256AETC144-5 Intel Corporation

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