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EPM7512AEFC256-7 - Intel

Description: CPLD MAX® 7000A Family 10K Gates 512 Macro Cells 116.3MHz 3.3V 256-Pin FBGA Tray

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PCB Footprints
EPM7512AEFC256-7 - Intel PCB footprint - BGA - BGA - 256-FBGA (17x17) (option1)
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3D Models
EPM7512AEFC256-7 - Intel  - 3D model - BGA - 256-FBGA (17x17) (option1)
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EPM7512AEFC256-7 Details

  • Manufacturer Part Number:

    EPM7512AEFC256-7

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    FINE LINE, BGA-256

  • ECCN Code:

    3A991.d

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    512 MACROCELLS; 32 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3

  • Clock Frequency-Max:

    116.3 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PBGA-B256

  • JESD-609 Code:

    e0

  • JTAG BST:

    YES

  • Length:

    17 mm

  • Moisture Sensitivity Level:

    3

  • Number of Dedicated Inputs:

    4

  • Number of I/O Lines:

    212

  • Number of Inputs:

    216

  • Number of Macro Cells:

    512

  • Number of Outputs:

    212

  • Number of Terminals:

    256

  • Operating Temperature-Max:

    70 °C

  • Organization:

    4 DEDICATED INPUTS, 212 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA256,16X16,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    220

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Tin/Lead (Sn63Pb37)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Width:

    17 mm

EPM7512AEFC256-7 Frequently Asked Questions (FAQs)

  • The recommended operating temperature range for the EPM7512AEFC256-7 is 0°C to 85°C (commercial temperature range) or -40°C to 100°C (industrial temperature range), depending on the specific application and requirements.
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which can detect the power supply voltage and generate a reset signal to the EPM7512AEFC256-7. The voltage supervisor IC should be connected to the VCC pin of the FPGA.
  • For optimal performance and signal integrity, it is recommended to follow Intel's guidelines for PCB layout and routing, including using a 4-layer PCB, separating analog and digital signals, and minimizing signal trace lengths and vias.
  • To configure the EPM7512AEFC256-7 for low-power operation, use the Intel Quartus II software to optimize the design for power consumption, enable the low-power mode, and adjust the clock frequency and voltage supply accordingly.
  • To minimize EMI and ensure EMC, follow Intel's guidelines for PCB layout, use shielding and grounding techniques, and implement EMI filters and shielding on the PCB. Additionally, ensure that the system meets the relevant regulatory requirements for EMI and EMC.

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EPM7512AEFC256-7 Overview

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Part Image EPM7512AEFC256-7 Altera Corporation

EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256

Part Image EPM7512AEFC256-7N Altera Corporation

EE PLD, 7.5ns, 512-Cell, CMOS, PBGA256