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ER1M - Diotec

Description: Rectifiers Diode, Superfast, SMA, 1000V, 1A, 150C

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Symbol
ER1M - Diotec - PCB symbol
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PCB Footprints
ER1M - Diotec PCB footprint - Diodes Moulded - Diodes Moulded - SMA ~ DO-214AC
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3D Models
ER1M - Diotec - 3D model - Diodes Moulded - SMA ~ DO-214AC
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ER1M Details

  • Manufacturer Part Number:

    ER1M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-214AC

  • Package Description:

    SMA, 2 PIN

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Diotec Semiconductor AG

  • YTEOL:

    7

  • Application:

    SUPER FAST RECOVERY

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.7 V

  • JEDEC-95 Code:

    DO-214AC

  • JESD-30 Code:

    R-PDSO-C2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    33 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -50 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    1000 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.075 µs

  • Reverse Test Voltage:

    1000 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    5

ER1M Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to use a large copper area on the bottom side of the PCB as a heat sink, connected to the ER1M's thermal pad through a thermal via. This helps to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended derating curves for the ER1M. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature, and ensure good airflow around the device.
  • Exceeding the maximum junction temperature (Tj) of 150°C can lead to a reduction in the ER1M's lifespan, increased thermal resistance, and potentially even device failure. It's crucial to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
  • Yes, the ER1M can be used in switching regulator applications. However, it's essential to consider the device's switching characteristics, such as the rise and fall times, and ensure that the regulator's design takes into account the ER1M's limitations and characteristics.
  • When designing a PCB for the ER1M, it's crucial to ensure that the traces and vias can handle the high current capability of the device. Use wide traces, multiple vias, and consider using a copper thickness of at least 2 oz to minimize resistance and ensure reliable operation.

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ER1M Overview

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For a full list of alternate parts for ER1M, check out Findchips.com