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ER3105DI - Intel

Description: Switching Voltage Regulators 500mA Step-Down w/ Int MOSFETs

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ER3105DI - Intel PCB footprint - Small Outline No-lead - Small Outline No-lead - QFN-12_3x4mm
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3D Models
ER3105DI - Intel  - 3D model - Small Outline No-lead - QFN-12_3x4mm
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ER3105DI Details

  • Manufacturer Part Number:

    ER3105DI

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    ALSO OPERATES IN PFM CONTROL TECHNIQUE

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    36 V

  • Input Voltage-Min:

    3 V

  • Input Voltage-Nom:

    6 V

  • JESD-30 Code:

    R-PDSO-N12

  • Length:

    4 mm

  • Number of Functions:

    1

  • Number of Terminals:

    12

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    1 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVSON

  • Package Equivalence Code:

    SOLCC12,.12,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Width:

    3 mm

ER3105DI Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated thermal plane and vias connecting the thermal pad to the thermal plane is recommended for optimal thermal performance.
  • Ensure proper thermal design, follow recommended PCB layout, and consider using thermal interface materials to minimize thermal resistance.
  • Not using the exposed thermal pad can lead to reduced thermal performance, increased junction temperature, and potentially reduced lifespan.
  • Yes, but ensure proper PCB design, component mounting, and consider using underfill or potting to mitigate vibration effects.
  • Follow standard ESD handling procedures, use ESD-protective packaging, and consider adding external ESD protection devices if necessary.

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ER3105DI Overview

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Image Part Number Model
Part Image ER3105DIT Intel Corporation

Switching Regulator, Current-mode, 1A, 2000kHz Switching Freq-Max, PDSO12