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ERA2AEB303X - Panasonic

Description: Panasonic ERA Series Thin Film Surface Mount Resistor 0402 Case 30kΩ ±0.1% 63mW ±25ppm/°C

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ERA2AEB303X - Panasonic PCB footprint - Other - Other - ERA2A_(0402)
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ERA2AEB303X - Panasonic  - 3D model - Other - ERA2A_(0402)
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ERA2AEB303X Details

  • Manufacturer Part Number:

    ERA2AEB303X

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    15

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.063 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    30000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    50 V

ERA2AEB303X Frequently Asked Questions (FAQs)

  • The recommended land pattern for the ERA2AEB303X is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle the ERA2AEB303X's sensitivity to moisture, it is recommended to store the components in a dry environment with a relative humidity of 60% or less. During assembly, the components should be baked at 125°C for 24 hours to remove any moisture. Additionally, the components should be soldered within 168 hours of opening the package.
  • The maximum allowable voltage for the ERA2AEB303X is 50V. Exceeding this voltage may cause damage to the component or affect its reliability.
  • To ensure the ERA2AEB303X is properly soldered, use a soldering iron with a temperature of 350°C or less, and a solder with a melting point of 217°C or higher. The soldering time should be limited to 3 seconds or less, and the component should be soldered in a nitrogen atmosphere to prevent oxidation.
  • The thermal resistance of the ERA2AEB303X is 150°C/W. This value is based on the component being mounted on a 1oz copper PCB with a thermal via under the component.

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ERA2AEB303X Overview

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Part Image WF04U3002BALQ Walsin Technology Corporation

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Part Image RN731ELTP3002B25 KOA Speer Electronics Inc

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For a full list of alternate parts for ERA2AEB303X, check out Findchips.com