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ERA3AEB2211V - Panasonic

Description: Panasonic ERA Series Thin Film Surface Mount Resistor 603 Case 2.21kΩ ±0.1% 0.1W ±25ppm/°C

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ERA3AEB2211V - Panasonic - PCB symbol
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PCB Footprints
ERA3AEB2211V - Panasonic PCB footprint - Other - Other - ERA3A
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3D Models
ERA3AEB2211V - Panasonic - 3D model - Other - ERA3A
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ERA3AEB2211V Details

  • Manufacturer Part Number:

    ERA3AEB2211V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    2210 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    75 V

ERA3AEB2211V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERA3AEB2211V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERA3AEB2211V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The maximum operating temperature range for ERA3AEB2211V is -55°C to +125°C. However, the component's electrical characteristics may degrade above 85°C, and it's recommended to operate it within the -40°C to +85°C range for optimal performance.
  • Yes, the ERA3AEB2211V is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent mechanical stress.
  • To prevent moisture absorption, ERA3AEB2211V components should be stored in a dry environment with a relative humidity of 60% or less. The components should be stored in their original packaging or in a sealed bag with desiccant. Baking the components at 125°C for 24 hours can also be done to remove any absorbed moisture.

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ERA3AEB2211V Overview

Use the download button to access the ERA3AEB2211V schematic symbol, PCB footprint, and 3D model.
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For a full list of alternate parts for ERA3AEB2211V, check out Findchips.com