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ERA3ARB203V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERA3ARB203V - RES, METAL FILM, 20K, 0.1%, 0.1W, 0603

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ERA3ARB203V - Panasonic PCB footprint - Other - Other - ERA3A
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ERA3ARB203V - Panasonic  - 3D model - Other - ERA3A
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ERA3ARB203V Details

  • Manufacturer Part Number:

    ERA3ARB203V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    20000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    10 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    75 V

ERA3ARB203V Frequently Asked Questions (FAQs)

  • The recommended land pattern for the ERA3ARB203V is a rectangular pad with a size of 2.5mm x 1.25mm, with a 0.5mm radius corner. The pad should be centered on the component and have a non-solder mask defined (NSMD) pad shape.
  • To handle the ERA3ARB203V's sensitivity to moisture, it is recommended to store the components in a dry environment with a relative humidity of 60% or less. It is also recommended to bake the components at 125°C for 24 hours before reflow soldering to remove any moisture that may have been absorbed.
  • The maximum reflow temperature for the ERA3ARB203V is 260°C. It is recommended to use a reflow profile with a peak temperature of 250°C to ensure reliable soldering and to prevent damage to the component.
  • Yes, the ERA3ARB203V is suitable for high-frequency applications up to 1 GHz. However, it is recommended to use a suitable PCB material and layout to minimize signal loss and ensure reliable operation.
  • To ensure the ERA3ARB203V's reliability in high-temperature environments, it is recommended to use a suitable thermal management strategy, such as heat sinks or thermal interfaces, to keep the component temperature below 125°C. It is also recommended to use a reliable soldering process and to follow the recommended storage and handling procedures.

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ERA3ARB203V Overview

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