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ERA6AEB112V - Panasonic

Description: Panasonic E24 Series Thin Film Surface Mount Resistor 0805 Case 1.1kΩ ±0.1% 0.125W ±25ppm/°C

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ERA6AEB112V - Panasonic PCB footprint - Other - Other - ERA6A
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ERA6AEB112V - Panasonic  - 3D model - Other - ERA6A
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ERA6AEB112V Details

  • Manufacturer Part Number:

    ERA6AEB112V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    1100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

ERA6AEB112V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERA6AEB112V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERA6AEB112V, ensure that the component is mounted on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance (Rth) is 150°C/W. Additionally, consider using a heat sink or thermal interface material to further reduce thermal resistance.
  • The recommended reflow soldering profile for ERA6AEB112V is a peak temperature of 260°C, with a dwell time above 220°C of 20-30 seconds. The ramp-up rate should be 3°C/second, and the ramp-down rate should be 6°C/second. Ensure that the component is not exposed to temperatures above 260°C for more than 30 seconds.
  • ERA6AEB112V is designed to withstand moderate vibration levels. However, for high-vibration environments, it is recommended to use additional mechanical support, such as a bracket or adhesive, to ensure the component remains securely attached to the PCB. Consult with Panasonic's application engineers for specific guidance on vibration testing and mitigation strategies.
  • To ensure the reliability of ERA6AEB112V in a humid environment, follow proper storage and handling procedures to prevent moisture absorption. Use a moisture barrier bag or desiccant to store the components, and ensure that the PCB is properly cleaned and dried before assembly. Additionally, consider applying a conformal coating to protect the component from moisture ingress.

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ERA6AEB112V Overview

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Part Image BLU0805-1101-BT25 RCD Components Inc

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Part Image PRC0805TTC25W1.1K+-0.1% Precision Resistive Products Inc

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Part Image BLU0805M-1101-BT25W RCD Components Inc

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