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ERA6AEB181V - Panasonic

Description: Panasonic ERA Series Thin Film Surface Mount Resistor 0805 Case 180Ω ±0.1% 0.125W ±25ppm/°C

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ERA6AEB181V - Panasonic - PCB symbol
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PCB Footprints
ERA6AEB181V - Panasonic PCB footprint - Other - Other - ERA6A
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3D Models
ERA6AEB181V - Panasonic - 3D model - Other - ERA6A
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ERA6AEB181V Details

  • Manufacturer Part Number:

    ERA6AEB181V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    14

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.5 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED PAPER, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    85 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    180 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    THIN FILM

  • Temperature Coefficient:

    25 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    0.1%

  • Working Voltage:

    100 V

ERA6AEB181V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERA6AEB181V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERA6AEB181V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The maximum power rating for ERA6AEB181V is 250mW at an ambient temperature of 70°C. However, the power rating may be derated at higher temperatures, and the component should be used within the recommended operating temperature range of -55°C to 125°C.
  • Yes, ERA6AEB181V is suitable for high-frequency applications up to 1GHz. However, the component's performance may be affected by the PCB layout, and proper impedance matching and decoupling should be ensured to minimize signal loss and distortion.
  • ERA6AEB181V should be stored in a dry environment with a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption. Baking the component at 125°C for 24 hours can also be done to remove any absorbed moisture.

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ERA6AEB181V Overview

Use the download button to access the ERA6AEB181V schematic symbol, PCB footprint, and 3D model.
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