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ERJ12SF10R0U - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ12SF10R0U - RES, THICK FILM, 10R, 1%, 0.75W, 2010

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ERJ12SF10R0U - Panasonic - PCB symbol
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PCB Footprints
ERJ12SF10R0U - Panasonic PCB footprint - Other - Other - ERJ12(S/Z)
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ERJ12SF10R0U - Panasonic - 3D model - Other - ERJ12(S/Z)
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ERJ12SF10R0U Details

  • Manufacturer Part Number:

    ERJ12SF10R0U

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    24 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.75 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    10 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ12SF10R0U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ12SF10R0U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ12SF10R0U should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature, with a dwell time of 30-60 seconds above 220°C.
  • The maximum power rating for ERJ12SF10R0U is 0.5W. Exceeding this rating may cause the component to overheat, leading to reduced reliability or even failure.
  • Yes, ERJ12SF10R0U is designed to withstand vibrations up to 10G (10m/s²) in the frequency range of 10-2000Hz. However, it's recommended to perform additional testing and validation to ensure the component meets the specific requirements of your application.
  • ERJ12SF10R0U should be stored in a dry, cool place (less than 30°C and 60% RH) away from direct sunlight and moisture. The component should be stored in its original packaging or in a sealed bag to prevent moisture absorption.

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ERJ12SF10R0U Overview

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