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ERJ12ZYJ331U - Panasonic

Description: PANASONIC - ERJ12ZYJ331U - SMD Chip Resistor, 2010 [5025 Metric], 330 ohm, ERJ12Z Series, 200 V, Thick Film, 750 mW

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ERJ12ZYJ331U - Panasonic PCB footprint - Other - Other - ERJ12(S/Z)
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ERJ12ZYJ331U - Panasonic  - 3D model - Other - ERJ12(S/Z)
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ERJ12ZYJ331U Details

  • Manufacturer Part Number:

    ERJ12ZYJ331U

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    5 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.75 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    330 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2010

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

ERJ12ZYJ331U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ12ZYJ331U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ12ZYJ331U should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJ12ZYJ331U is 0.25W. Exceeding this rating may cause the component to overheat and fail.
  • Yes, ERJ12ZYJ331U is designed to withstand vibrations up to 10G. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
  • Yes, ERJ12ZYJ331U is RoHS compliant, meaning it does not contain hazardous substances such as lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE) above the maximum allowed levels.

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ERJ12ZYJ331U Overview

Use the download button to access the ERJ12ZYJ331U schematic symbol, PCB footprint, and 3D model.
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Part Image RK73B2HTTEB331J KOA Speer Electronics Inc

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Part Image MC2010-331-JB201W RCD Components Inc

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Part Image MC2010P-331-JB201 RCD Components Inc

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Part Image NRC-S50J331TRQF NIC Components Corp

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 330ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 2010, CHIP

Part Image RK73BW2HRTTE331J KOA Speer Electronics Inc

Fixed Resistor, Metal Glaze/thick Film, 0.75W, 330ohm, 200V, 5% +/-Tol, 200ppm/Cel, Surface Mount, 2010

For a full list of alternate parts for ERJ12ZYJ331U, check out Findchips.com