The recommended land pattern for ERJ14NF6802U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
During reflow soldering, the ERJ14NF6802U should be placed on a flat, even surface to prevent warping or deformation. The component should be aligned with the PCB pads and secured with a gentle pressure to prevent movement during the soldering process. The recommended reflow temperature profile is 260°C peak temperature with a 3-5°C/s ramp rate.
The maximum power rating for ERJ14NF6802U is 0.5W. However, the actual power rating may vary depending on the operating conditions, such as ambient temperature, voltage, and current. It is recommended to derate the power rating by 20-30% to ensure reliable operation.
Yes, ERJ14NF6802U is suitable for high-frequency applications up to 100MHz. However, the component's performance may degrade at higher frequencies due to parasitic inductance and capacitance. It is recommended to use a suitable PCB layout and component placement to minimize these effects.
ERJ14NF6802U should be stored in a dry, cool place away from direct sunlight and moisture. The component should be handled with care to prevent mechanical stress, bending, or twisting. It is recommended to use anti-static packaging and handling procedures to prevent electrostatic discharge (ESD) damage.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ERJ14NF6802U Overview
Use the download button to access the ERJ14NF6802U schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ14,
or try a keyword search, such as Fixed Resistors
