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ERJ14NF7501U - Panasonic

Description: Precision Thick Film Chip Resistor, 1210, 0.5W

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Symbol
ERJ14NF7501U - Panasonic - PCB symbol
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PCB Footprints
ERJ14NF7501U - Panasonic PCB footprint - Other - Other - ERJ14N_(1210)
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3D Models
ERJ14NF7501U - Panasonic - 3D model - Other - ERJ14N_(1210)
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ERJ14NF7501U Details

  • Manufacturer Part Number:

    ERJ14NF7501U

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    7500 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ14NF7501U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ14NF7501U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ14NF7501U, ensure that the component is placed on a thermally conductive substrate, and provide adequate thermal vias to dissipate heat. The recommended thermal resistance is ≤10°C/W.
  • The recommended soldering profile for ERJ14NF7501U is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • Yes, ERJ14NF7501U is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and ensure that the component is properly secured to the PCB.
  • To ensure the reliability of ERJ14NF7501U in a humid environment, apply a conformal coating to the PCB, and ensure that the component is stored in a dry environment before assembly. The component should also be handled in accordance with the manufacturer's guidelines for moisture sensitivity.

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ERJ14NF7501U Overview

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ERJ14NF7501U Alternates

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Part Image WR10X7501FGLJ Walsin Technology Corporation

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Part Image CQ07U2J0752T2E Royal Electronic Factory (Thailand) Co Ltd

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Part Image HFWF12FT-7501-S Hitano Enterprise Corp

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Part Image FWF12FT-7501-W Prosperity Dielectrics Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.5W, 7500ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210
Part Image WR10X7501FBLV Walsin Technology Corporation

Fixed Resistor, 0.5W, 7500ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1210, CHIP, ROHS COMPLIANT
For a full list of alternate parts for ERJ14NF7501U, check out Findchips.com