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ERJ14YJ103U - Panasonic

Description: Thick Film Resistors - SMD 1210 10Kohms 5% AEC-Q200

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ERJ14YJ103U - Panasonic - PCB symbol
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PCB Footprints
ERJ14YJ103U - Panasonic PCB footprint - Other - Other - ERJ14R/B
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3D Models
ERJ14YJ103U - Panasonic - 3D model - Other - ERJ14R/B
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ERJ14YJ103U Details

  • Manufacturer Part Number:

    ERJ14YJ103U

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    2.5 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    0.5 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    10000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1210

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    5%

  • Working Voltage:

    200 V

ERJ14YJ103U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ14YJ103U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
  • During reflow soldering, the ERJ14YJ103U should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
  • The maximum power rating for ERJ14YJ103U is 0.25W. Exceeding this rating may cause the component to overheat and fail prematurely.
  • Yes, ERJ14YJ103U is suitable for high-frequency applications up to 100MHz. However, the component's impedance and parasitic effects should be considered in the design to ensure optimal performance.
  • ERJ14YJ103U is not suitable for use in humid environments. The component is sensitive to moisture and may absorb moisture, leading to degradation or failure. If operation in a humid environment is required, a moisture-resistant coating or conformal coating should be applied.

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ERJ14YJ103U Overview

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