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ERJ1GNF1201C - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ1GNF1201C - RES, THICK FILM, 1K2, 1%, 0.05W, 0201

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ERJ1GNF1201C - Panasonic - PCB symbol
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PCB Footprints
ERJ1GNF1201C - Panasonic PCB footprint - Other - Other - ERJ1G
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3D Models
ERJ1GNF1201C - Panasonic - 3D model - Other - ERJ1G
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ERJ1GNF1201C Details

  • Manufacturer Part Number:

    ERJ1GNF1201C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.23 mm

  • Package Length:

    0.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PRESSED, 7 INCH

  • Rated Power Dissipation (P):

    0.05 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    IEC60115-8

  • Resistance:

    1200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0201

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    25 V

ERJ1GNF1201C Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ1GNF1201C is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
  • While ERJ1GNF1201C has a rated operating temperature range of -55°C to 125°C, it's not recommended for use in high-temperature applications above 105°C without proper derating. Consult the datasheet for derating guidelines.
  • Handle ERJ1GNF1201C by the edges to prevent damage to the component. Avoid touching the component's leads or body to prevent electrostatic discharge (ESD) damage. Use an ESD wrist strap or mat if necessary.
  • The recommended soldering profile for ERJ1GNF1201C is a peak temperature of 260°C, with a dwell time of 10-30 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • ERJ1GNF1201C is not designed for use in high-humidity environments. If used in such environments, it may be prone to moisture ingress, which can affect its performance and reliability. Consider using a moisture-resistant coating or conformal coating if necessary.

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ERJ1GNF1201C Overview

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ERJ1GNF1201C Alternates

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Part Image ASAS05-1201-FN ASJ Holdings Limited

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Part Image RMS02FT122 TA-I Technology Co Ltd

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Part Image CR05-1201-FN ASJ Holdings Limited

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Part Image RC01W122FCG Fenghua (HK) Electronics Ltd

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Part Image MCRE000142 SPC Multicomp

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For a full list of alternate parts for ERJ1GNF1201C, check out Findchips.com