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ERJ1GNF30R0C - Panasonic

Description: PANASONIC - ERJ1GNF30R0C - SMD Chip Resistor, 0201 [0603 Metric], 30 ohm, ERJ1G Series, 25 V, Thick Film, 50 mW

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ERJ1GNF30R0C - Panasonic - PCB symbol
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PCB Footprints
ERJ1GNF30R0C - Panasonic PCB footprint - Other - Other - ERJ1G
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3D Models
ERJ1GNF30R0C - Panasonic - 3D model - Other - ERJ1G
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ERJ1GNF30R0C Details

  • Manufacturer Part Number:

    ERJ1GNF30R0C

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.23 mm

  • Package Length:

    0.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.3 mm

  • Packing Method:

    TR, PRESSED, 7 INCH

  • Rated Power Dissipation (P):

    0.05 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    IEC60115-8

  • Resistance:

    30 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0201

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    200 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    25 V

ERJ1GNF30R0C Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ1GNF30R0C is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ1GNF30R0C should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The maximum power rating for ERJ1GNF30R0C is 0.25W. Exceeding this rating may cause the component to overheat and fail.
  • Yes, ERJ1GNF30R0C is suitable for high-frequency applications up to 1GHz. However, the component's performance may degrade at higher frequencies due to parasitic inductance and capacitance.
  • ERJ1GNF30R0C is not suitable for use in humid environments. The component is sensitive to moisture and may absorb moisture, leading to degradation or failure. If used in a humid environment, the component should be sealed or coated to prevent moisture ingress.

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ERJ1GNF30R0C Overview

Use the download button to access the ERJ1GNF30R0C schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ1G, or try a keyword search, such as Fixed Resistors

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ERJ1GNF30R0C Alternates

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Part Image RC0201FR-0730R YAGEO Corporation

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Part Image CAR02F30R0CT Cal-Chip Electronics

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