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ERJ1TRQFR39U - Panasonic

Description: Low Ohmic Resistor, 2512,1W,1%,R39 Panasonic ERJ1T Series Thick Film Low Ohmic Surface Mount Resistor 2512 Case 390mΩ ±1% 1W ±200ppm/°C

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ERJ1TRQFR39U - Panasonic - PCB symbol
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PCB Footprints
ERJ1TRQFR39U - Panasonic PCB footprint - Other - Other - ERJ-1T(2512)
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ERJ1TRQFR39U - Panasonic - 3D model - Other - ERJ-1T(2512)
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ERJ1TRQFR39U Details

  • Manufacturer Part Number:

    ERJ1TRQFR39U

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    10

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    6.4 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    3.2 mm

  • Packing Method:

    TR, EMBOSSED, 7 INCH

  • Rated Power Dissipation (P):

    1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    0.39 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    2512

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,200 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.6245 V

ERJ1TRQFR39U Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ1TRQFR39U is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ1TRQFR39U, ensure that the component is placed on a thermally conductive substrate, and that there is adequate thermal relief around the component. A thermal via or thermal pad can be used to dissipate heat. The maximum operating temperature is 125°C, and the component should be derated above 85°C.
  • The recommended soldering process for ERJ1TRQFR39U is a reflow soldering process with a peak temperature of 260°C and a dwell time of 30-60 seconds. The component should be soldered using a Pb-free solder alloy, and the soldering process should be optimized to minimize thermal shock and prevent damage to the component.
  • To ensure the reliability of ERJ1TRQFR39U in high-vibration applications, ensure that the component is securely attached to the PCB using a suitable adhesive or mechanical fastening method. The PCB should be designed to minimize flexure and vibration, and the component should be placed in a location that minimizes exposure to vibration.
  • The equivalent series resistance (ESR) of ERJ1TRQFR39U is typically around 0.1 ohms, but this value can vary depending on the frequency and operating conditions. The ESR should be considered when designing the circuit to ensure that the component operates within its specified parameters.

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ERJ1TRQFR39U Overview

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Fixed Resistor, Metal Glaze/thick Film, 1W, 0.39ohm, 0.6245V, 1% +/-Tol, 0,200ppm/Cel, Surface Mount, 2512