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ERJ2BWFR050X - Panasonic

Description: Low Resistance Thick Film Chip Resistor, 0402, 0.25W

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PCB Footprints
ERJ2BWFR050X - Panasonic PCB footprint - Other - Other - ERJ_2LW_2BW_2B_(0402)
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3D Models
ERJ2BWFR050X - Panasonic  - 3D model - Other - ERJ_2LW_2BW_2B_(0402)
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ERJ2BWFR050X Details

  • Manufacturer Part Number:

    ERJ2BWFR050X

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    HIGH-PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.35 mm

  • Package Length:

    1 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.5 mm

  • Packing Method:

    TR, PRESSED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200

  • Resistance:

    0.05 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0402

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    300 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.1118 V

ERJ2BWFR050X Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ2BWFR050X is a rectangular pad with a size of 0.8mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
  • To prevent damage, handle the ERJ2BWFR050X by the body only, avoiding touching the terminals. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the component during assembly.
  • The maximum soldering temperature for ERJ2BWFR050X is 260°C (500°F) for a maximum of 10 seconds. Exceeding this temperature or time may damage the component.
  • Yes, ERJ2BWFR050X is designed to withstand vibrations up to 10G (98m/s²) in the frequency range of 10Hz to 2000Hz. However, it's recommended to perform additional testing and validation for specific vibration profiles.
  • Store ERJ2BWFR050X components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. The recommended storage conditions are -10°C to 40°C (14°F to 104°F) and 20% to 80% relative humidity.

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ERJ2BWFR050X Overview

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