ERJ2BWFR100X footprint, schematic symbol and 3D model by Panasonic

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ERJ2BWFR100X Details

The recommended land pattern for ERJ2BWFR100X is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While ERJ2BWFR100X has a rated operating temperature range of -55°C to 125°C, it's not recommended for use in high-temperature applications above 105°C. Prolonged exposure to high temperatures can affect the resistor's stability and reliability.
To prevent damage, handle ERJ2BWFR100X by the edges or use a vacuum pickup tool. Avoid touching the component's leads or body, as the oils from human skin can affect solderability. Also, ensure the PCB is clean and dry before assembly.
The recommended soldering profile for ERJ2BWFR100X is a peak temperature of 260°C, with a dwell time of 10-30 seconds. A slower ramp-up and cool-down rate can help prevent thermal shock and ensure reliable solder joints.
While ERJ2BWFR100X has a moisture sensitivity level (MSL) of 1, it's still important to follow proper storage and handling procedures to prevent moisture absorption. In high-humidity environments, consider using a conformal coating or potting compound to protect the component.

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