ERJ2RHD5101X footprint, schematic symbol and 3D model by Panasonic

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ERJ2RHD5101X Details

The recommended land pattern for ERJ2RHD5101X is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
During reflow soldering, the ERJ2RHD5101X should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
The maximum power rating for ERJ2RHD5101X is 1/4W (250mW) at an ambient temperature of 70°C. However, the power rating can be derated to 1/8W (125mW) at higher temperatures.
Yes, ERJ2RHD5101X is suitable for high-frequency applications up to 100MHz. However, the impedance of the resistor may vary at high frequencies, and the component should be used in conjunction with a suitable PCB layout and decoupling capacitors to minimize parasitic effects.
ERJ2RHD5101X should be stored in a dry environment with a relative humidity of less than 60%. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.

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