The recommended land pattern for ERJ2RKD33R0X is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
During reflow soldering, the ERJ2RKD33R0X should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
The ERJ2RKD33R0X is a general-purpose resistor and is not specifically designed for high-frequency applications. However, it can be used up to 100 MHz with minimal signal attenuation. For high-frequency applications above 100 MHz, a high-frequency resistor with a lower ESL (equivalent series inductance) should be considered.
The ERJ2RKD33R0X has a maximum operating temperature of 155°C. While it can withstand short-term excursions up to 200°C, prolonged exposure above 155°C may affect its reliability and lifespan. If your application requires operation above 155°C, a high-temperature resistor should be considered.
The ERJ2RKD33R0X has a power rating of 1/8W. To ensure it meets your application's power rating requirements, calculate the maximum power dissipation using the formula P = V^2/R, where V is the voltage across the resistor and R is the resistance value. Ensure the calculated power dissipation is below the maximum power rating of 1/8W.
Trust Checks
This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored
ERJ2RKD33R0X Overview
Use the download button to access the ERJ2RKD33R0X schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ2R,
or try a keyword search, such as Metal Glaze/Thick Film Resistors
