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ERJ3BQFR33V - Panasonic

Description: Panasonic ERJ3B Series Thick Film Low Ohmic Surface Mount Resistor 0603 Case 330mΩ ±1% 0.2W ±300ppm/°C

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ERJ3BQFR33V - Panasonic PCB footprint - Resistor Chip - Resistor Chip - ERJ3B
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ERJ3BQFR33V - Panasonic  - 3D model - Resistor Chip - ERJ3B
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ERJ3BQFR33V Details

  • Manufacturer Part Number:

    ERJ3BQFR33V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    HIGH PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200, IEC60115-8

  • Resistance:

    0.33 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    0,300 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    0.2872 V

ERJ3BQFR33V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3BQFR33V is a rectangular pad with a size of 0.8mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
  • To prevent damage, handle the ERJ3BQFR33V by the body, avoiding touching the terminals. Use anti-static wrist straps, mats, or packaging to prevent electrostatic discharge (ESD) damage. Avoid bending or flexing the component during assembly.
  • The maximum soldering temperature for ERJ3BQFR33V is 260°C (500°F) for a maximum of 10 seconds. Exceeding this temperature or time may damage the component.
  • Yes, ERJ3BQFR33V is designed to withstand vibrations up to 10G (98m/s²) in the frequency range of 10-2000Hz. However, it's recommended to perform additional testing and validation for specific vibration profiles and environments.
  • Store ERJ3BQFR33V components in their original packaging, away from direct sunlight, moisture, and extreme temperatures. The recommended storage conditions are -10°C to 40°C (14°F to 104°F) and 20% to 80% relative humidity.

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ERJ3BQFR33V Overview

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Image Part Number Model
Part Image ERJ3BSFR33V Panasonic Electronic Components

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0.33ohm, 0.2872V, 1% +/-Tol, 0,300ppm/Cel, Surface Mount, 0603, CHIP

Part Image ERJ3BQFR330V Panasonic Electronic Components

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 0.33ohm, 0.2872V, 1% +/-Tol, 0,300ppm/Cel, Surface Mount, 0603