The recommended land pattern for ERJ3EKF1102V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
During reflow soldering, the ERJ3EKF1102V should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
The maximum power rating for ERJ3EKF1102V is 0.25W. Exceeding this rating may cause the component to overheat and fail.
Yes, ERJ3EKF1102V is designed to withstand vibrations up to 10G. However, it's recommended to follow proper mounting and soldering techniques to ensure the component remains securely attached to the PCB.
Yes, ERJ3EKF1102V is RoHS compliant, meaning it does not contain hazardous substances such as lead, mercury, cadmium, hexavalent chromium, polybrominated biphenyls (PBB), or polybrominated diphenyl ethers (PBDE) above the maximum allowed levels.
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ERJ3EKF1102V Overview
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