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ERJ3EKF1270V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ3EKF1270V - RES, 127R, 1%, 0.1W, 0603, THICK FILM

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ERJ3EKF1270V - Panasonic - PCB symbol
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PCB Footprints
ERJ3EKF1270V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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ERJ3EKF1270V - Panasonic - 3D model - Other - ERJ3G(0603)
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ERJ3EKF1270V Details

  • Manufacturer Part Number:

    ERJ3EKF1270V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    49 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    127 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF1270V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF1270V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ3EKF1270V should be placed on a flat, even surface to prevent warping or deformation. The component should be aligned with the PCB pads and secured with a gentle pressure to ensure proper solder wetting. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The maximum power rating for ERJ3EKF1270V is 0.25W. Exceeding this rating may cause the component to overheat, leading to reduced performance or even failure.
  • Yes, ERJ3EKF1270V is suitable for high-frequency applications up to 100MHz. However, it's essential to consider the component's self-resonant frequency, which is around 10MHz, and take necessary precautions to minimize parasitic inductance and capacitance.
  • ERJ3EKF1270V should be stored in a dry, cool place (less than 30°C and 60% RH) away from direct sunlight and moisture. The component should be stored in its original packaging or a similar anti-static package to prevent electrostatic discharge (ESD) damage.

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ERJ3EKF1270V Overview

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ERJ3EKF1270V Alternates

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Part Image D1106030B1270FBN Vishay Intertechnologies

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Part Image CR-03FL5--127R Viking Tech Corp

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Part Image CRCW0603127RFKEE Vishay Intertechnologies

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Part Image RC0603FR-13127RL YAGEO Corporation

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Part Image CDF0603127R1%100PPM/KNP5 Microtech GmbH Electronic

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 127ohm, 75V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0603
For a full list of alternate parts for ERJ3EKF1270V, check out Findchips.com