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ERJ3EKF3241V - Panasonic

Description: Thick Film Chip Resistor 0.1W 0603 3K24 Panasonic E96 Series Precision Thick Film Surface Mount Resistor 0603 Case 3.24kΩ ±1% 0.1W ±100ppm/°C

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ERJ3EKF3241V - Panasonic - PCB symbol
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PCB Footprints
ERJ3EKF3241V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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ERJ3EKF3241V - Panasonic - 3D model - Other - ERJ3G(0603)
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ERJ3EKF3241V Details

  • Manufacturer Part Number:

    ERJ3EKF3241V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    32 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    3240 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF3241V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF3241V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ3EKF3241V, ensure that the component is placed on a thermally conductive substrate, and provide a thermal relief pattern on the PCB to dissipate heat. The maximum operating temperature is 125°C, and the component should be derated above 85°C.
  • The recommended soldering profile for ERJ3EKF3241V is a reflow profile with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. Hand soldering is not recommended.
  • To ensure the reliability of ERJ3EKF3241V in high-vibration applications, use a robust PCB design with a secure component mounting, and consider using underfill or potting compounds to enhance mechanical stability.
  • The equivalent series resistance (ESR) of ERJ3EKF3241V is typically around 0.1 ohms, but this value can vary depending on the frequency and operating conditions. Consult the datasheet or contact Panasonic for more information.

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ERJ3EKF3241V Overview

Use the download button to access the ERJ3EKF3241V schematic symbol, PCB footprint, and 3D model.
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