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ERJ3EKF56R0V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ3EKF56R0V - RES, THICK FILM, 56R, 1%, 0.1W, 0603

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ERJ3EKF56R0V - Panasonic - PCB symbol
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PCB Footprints
ERJ3EKF56R0V - Panasonic PCB footprint - Other - Other - ERJ3G(0603)
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ERJ3EKF56R0V - Panasonic - 3D model - Other - ERJ3G(0603)
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ERJ3EKF56R0V Details

  • Manufacturer Part Number:

    ERJ3EKF56R0V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    27 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    13

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.45 mm

  • Package Length:

    1.6 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    0.8 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.1 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    56 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0603

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    75 V

ERJ3EKF56R0V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ3EKF56R0V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ3EKF56R0V should be exposed to a peak temperature of 260°C for no more than 10 seconds. The component should be placed on a solder paste layer with a thickness of 0.1mm to 0.2mm, and the reflow profile should follow the JEDEC standard.
  • Yes, the ERJ3EKF56R0V is suitable for high-frequency applications up to 1 GHz. However, it's recommended to use a suitable PCB layout and impedance matching to minimize signal loss and ensure optimal performance.
  • The ERJ3EKF56R0V has a moisture sensitivity level (MSL) of 2, which means it can withstand a maximum relative humidity of 60% at 30°C for 60 hours. However, it's recommended to follow proper storage and handling procedures to prevent moisture absorption.
  • The ESR of the ERJ3EKF56R0V is typically around 0.1 ohms at 100 kHz. However, the actual ESR may vary depending on the frequency, temperature, and other operating conditions.

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ERJ3EKF56R0V Overview

Use the download button to access the ERJ3EKF56R0V schematic symbol, PCB footprint, and 3D model.
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