ERJ3RQFR33V footprint, schematic symbol and 3D model by Panasonic

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ERJ3RQFR33V Details

The recommended land pattern for ERJ3RQFR33V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
During reflow soldering, the ERJ3RQFR33V should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature with a 3-5°C/s ramp rate.
The maximum power rating for ERJ3RQFR33V is 0.25W. It is essential to ensure that the component does not exceed this power rating to prevent overheating and damage.
The ERJ3RQFR33V is rated for operation up to 125°C. While it can tolerate high temperatures, it is essential to ensure that the component does not exceed its maximum operating temperature to prevent degradation and failure.
ERJ3RQFR33V components should be stored in a dry, cool place away from direct sunlight and moisture. The components should be stored in their original packaging or in a sealed container to prevent damage and contamination.

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Use the download button to access the ERJ3RQFR33V schematic symbol, PCB footprint, and 3D model.

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