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ERJ6ENF2004V - Panasonic

Description: Panasonic ERJ6EN Series Thick Film Surface Mount Fixed Resistor 0805 Case 2MΩ ±1% 0.125W ±100ppm/°C

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Symbol
ERJ6ENF2004V - Panasonic - PCB symbol
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PCB Footprints
ERJ6ENF2004V - Panasonic PCB footprint - Other - Other - ERJ6EN
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3D Models
ERJ6ENF2004V - Panasonic - 3D model - Other - ERJ6EN
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ERJ6ENF2004V Details

  • Manufacturer Part Number:

    ERJ6ENF2004V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    65 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    2000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJ6ENF2004V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ6ENF2004V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ6ENF2004V should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • The maximum power rating for ERJ6ENF2004V is 0.25W. Exceeding this rating may cause the component to overheat and fail.
  • Yes, ERJ6ENF2004V is suitable for high-frequency applications up to 1GHz. However, the component's impedance and parasitic effects should be considered in the design to ensure optimal performance.
  • ERJ6ENF2004V should be stored in a dry, cool place with a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.

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ERJ6ENF2004V Overview

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ERJ6ENF2004V Alternates

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Part Image NQ05W8F2004T5E Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2000000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
Part Image RCS2012F2004CS Samsung Electro-Mechanics

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2000000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805,
Part Image RMC1/10K2004FTP Kamaya Inc

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Part Image RMC1/10K205FTP Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2000000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805, CHIP
Part Image MCR10PZHIF2004 ROHM Semiconductor

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 2000000ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805
For a full list of alternate parts for ERJ6ENF2004V, check out Findchips.com