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ERJ6ENF3002V - Panasonic

Description: Panasonic ERJ6EN Series Thick Film Surface Mount Fixed Resistor 0805 Case ±1% 0.125W ±100ppm/°C

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ERJ6ENF3002V - Panasonic - PCB symbol
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PCB Footprints
ERJ6ENF3002V - Panasonic PCB footprint - Other - Other - ERJ6EN
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3D Models
ERJ6ENF3002V - Panasonic - 3D model - Other - ERJ6EN
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ERJ6ENF3002V Details

  • Manufacturer Part Number:

    ERJ6ENF3002V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    27 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    30000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJ6ENF3002V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ6ENF3002V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ6ENF3002V should be placed on a flat, even surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow profile is 260°C peak temperature, with a dwell time of 30-60 seconds above 220°C.
  • The MSL of ERJ6ENF3002V is MSL 2, which means it can withstand exposure to moisture for up to 4 days at 30°C and 60% relative humidity before reflow soldering.
  • Yes, ERJ6ENF3002V is designed to withstand high-vibration environments. It has a vibration resistance of 10G (10Hz-2kHz) and can operate in environments with vibrations up to 20G (10Hz-2kHz) for short periods of time.
  • ERJ6ENF3002V should be stored in a dry, cool place with a relative humidity of 50% or less. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.

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ERJ6ENF3002V Overview

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