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ERJ6ENF6203V - Panasonic

Description: PANASONIC - ERJ6ENF6203V - RES, 620K, 1%, 0.125W, 0805, THICK FILM

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Symbol
ERJ6ENF6203V - Panasonic - PCB symbol
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PCB Footprints
ERJ6ENF6203V - Panasonic PCB footprint - Other - Other - ERJ6EN
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3D Models
ERJ6ENF6203V - Panasonic - 3D model - Other - ERJ6EN
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ERJ6ENF6203V Details

  • Manufacturer Part Number:

    ERJ6ENF6203V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    620000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJ6ENF6203V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ6ENF6203V can be found in the Panasonic's recommended land pattern document or by consulting with a PCB design expert. The land pattern should ensure proper soldering and thermal management.
  • To handle thermal considerations, ensure proper heat dissipation by providing a thermal pad on the PCB, using thermal vias, and keeping the component away from heat sources. Consult the datasheet for thermal resistance and junction temperature ratings.
  • The recommended soldering profile for ERJ6ENF6203V can be found in the Panasonic's soldering guidelines document or by consulting with a PCB assembly expert. The profile should ensure proper solder wetting and minimize thermal stress.
  • While ERJ6ENF6203V is a robust component, it's essential to evaluate its performance in a high-vibration environment. Consult with a mechanical engineer to ensure the component is properly secured and the PCB design can withstand the vibrations.
  • To ensure reliability in a humid environment, apply a conformal coating to the PCB, use a moisture-resistant PCB material, and follow proper storage and handling procedures to prevent moisture absorption.

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ERJ6ENF6203V Overview

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ERJ6ENF6203V Alternates

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Part Image RC2012F624ES Samsung Electro-Mechanics

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