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ERJ6ENF6652V - Panasonic

Description: Panasonic ERJ6EN Series Precision Thick Film Surface Mount Resistor 0805 Case 66.5kΩ ±1% 0.125W ±100ppm/°C

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ERJ6ENF6652V - Panasonic - PCB symbol
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PCB Footprints
ERJ6ENF6652V - Panasonic PCB footprint - Other - Other - ERJ6EN
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3D Models
ERJ6ENF6652V - Panasonic - 3D model - Other - ERJ6EN
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ERJ6ENF6652V Details

  • Manufacturer Part Number:

    ERJ6ENF6652V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    61 Weeks, 1 Day

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    66500 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJ6ENF6652V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ6ENF6652V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ6ENF6652V should be placed on a flat, even surface to prevent warping or deformation. The component should be exposed to a peak temperature of 260°C for no more than 10 seconds, and the total thermal exposure should not exceed 30 seconds.
  • The maximum power rating for ERJ6ENF6652V is 0.5W. Exceeding this rating can cause the component to overheat, leading to reduced performance or even failure.
  • Yes, ERJ6ENF6652V is designed to withstand vibrations up to 10G (10 times the acceleration due to gravity) in the frequency range of 10Hz to 2000Hz. However, it's recommended to perform additional testing and validation to ensure the component meets the specific requirements of your application.
  • ERJ6ENF6652V should be stored in a dry, cool place with a relative humidity of 60% or less. The component should be stored in its original packaging or in a sealed bag with desiccant to prevent moisture absorption.

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ERJ6ENF6652V Overview

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ERJ6ENF6652V Alternates

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Part Image CQ05WAF6652T5E Royal Electronic Factory (Thailand) Co Ltd

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Part Image 0805S8F6652BBE Royal Electronic Factory (Thailand) Co Ltd

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Part Image 0805S8F6652T4E Royal Electronic Factory (Thailand) Co Ltd

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