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ERJ6ENF68R0V - Panasonic

Description: Panasonic ERJ6EN Series Thick Film Surface Mount Fixed Resistor 0805 Case 68Ω ±1% 0.125W ±100ppm/°C

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ERJ6ENF68R0V - Panasonic - PCB symbol
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ERJ6ENF68R0V - Panasonic PCB footprint - Other - Other - ERJ6EN
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ERJ6ENF68R0V - Panasonic - 3D model - Other - ERJ6EN
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ERJ6ENF68R0V Details

  • Manufacturer Part Number:

    ERJ6ENF68R0V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    36 Weeks, 5 Days

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    68 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJ6ENF68R0V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ6ENF68R0V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ6ENF68R0V should be placed on a flat, even surface to prevent warping or deformation. The component should be exposed to a peak temperature of 260°C for no more than 30 seconds, and the soldering process should be completed within 3 minutes.
  • The MSL of ERJ6ENF68R0V is level 3, which means it can withstand a maximum of 168 hours of exposure to a relative humidity of 60% at 30°C before soldering.
  • Yes, ERJ6ENF68R0V is designed to withstand high-vibration environments. However, it's recommended to follow the manufacturer's guidelines for vibration testing and to ensure that the component is properly secured to the PCB to prevent damage or dislodging.
  • ERJ6ENF68R0V components should be stored in a dry, cool place away from direct sunlight and moisture. The storage temperature should be between -10°C and 40°C, and the relative humidity should be below 60%.

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ERJ6ENF68R0V Overview

Use the download button to access the ERJ6ENF68R0V schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like ERJ6E, or try a keyword search, such as Metal Glaze/Thick Film Resistors

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