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ERJ6ENF8251V - Panasonic

Description: PANASONIC - ERJ6ENF8251V - RES, 8K25, 1%, 0.125W, 0805, THICK FILM

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ERJ6ENF8251V - Panasonic PCB footprint - Other - Other - ERJ6EN
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ERJ6ENF8251V - Panasonic  - 3D model - Other - ERJ6EN
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ERJ6ENF8251V Details

  • Manufacturer Part Number:

    ERJ6ENF8251V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan, Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    20 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    12

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.25 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.125 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    8250 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    0805

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    150 V

ERJ6ENF8251V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ6ENF8251V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • To handle thermal considerations for ERJ6ENF8251V, ensure good thermal conduction by using a thermal pad or a heat sink, and keep the component away from heat sources. The maximum operating temperature is 125°C, and the storage temperature range is -55°C to 150°C.
  • The moisture sensitivity level of ERJ6ENF8251V is MSL 2, which means it can withstand a maximum of 24 hours of exposure to 30°C/60% RH before soldering.
  • Yes, ERJ6ENF8251V is designed to withstand vibrations up to 10G (10 Hz to 2 kHz) and can be used in high-vibration environments. However, it's recommended to follow proper mounting and soldering techniques to ensure reliability.
  • The recommended soldering profile for ERJ6ENF8251V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be completed within 3 minutes.

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ERJ6ENF8251V Overview

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ERJ6ENF8251V Alternates

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Part Image RMC1/10K8251FTP Kamaya Inc

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 8250ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

Part Image CQ05WAF8251TAE Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 8250ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

Part Image CQ05S8F8251T4E Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 8250ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

Part Image HQ05S8F8251TEE Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.125W, 8250ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

Part Image 0805WAF8251BBE Royal Electronic Factory (Thailand) Co Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.1W, 8250ohm, 150V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 0805

For a full list of alternate parts for ERJ6ENF8251V, check out Findchips.com