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ERJ8ENF1004V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ8ENF1004V - RES, THICK FILM, 1M, 1%, 0.25W, 1206

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ERJ8ENF1004V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF1004V - Panasonic  - 3D model - Other - ERJ8EN
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ERJ8ENF1004V Details

  • Manufacturer Part Number:

    ERJ8ENF1004V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    17 Weeks, 4 Days

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    1000000 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF1004V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF1004V is a rectangular pad with a size of 1.5mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape.
  • To handle thermal considerations, ensure good thermal conduction by using a thermal pad or a heat sink, and avoid overheating by keeping the operating temperature within the recommended range of -55°C to 125°C.
  • The recommended soldering profile for ERJ8ENF1004V is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C, and a cooling rate of 4°C/s or less.
  • Yes, ERJ8ENF1004V is designed to withstand vibrations up to 10G, making it suitable for use in high-vibration environments, such as in automotive or industrial applications.
  • To ensure reliability in humid environments, use a moisture-resistant coating or conformal coating, and follow proper storage and handling procedures to prevent moisture absorption.

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ERJ8ENF1004V Overview

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Part Image SR12X1004FGL Walsin Technology Corporation

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Part Image PWR06FTEO1004N Viking Tech Corp

Fixed Resistor, Metal Glaze/thick Film, 0.333W, 1e+06ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

Part Image RK73H2BATTD1004F KOA Speer Electronics Inc

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Part Image WCR1206-1M00FA TT Electronics Resistors

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 1000000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206

Part Image RS06K105FTL Fenghua (HK) Electronics Ltd

Fixed Resistor, Metal Glaze/thick Film, 0.25W, 1000000ohm, 200V, 1% +/-Tol, 100ppm/Cel, Surface Mount, 1206, CHIP

For a full list of alternate parts for ERJ8ENF1004V, check out Findchips.com