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ERJ8ENF1101V - Panasonic

Description: PANASONIC ELECTRONIC COMPONENTS - ERJ8ENF1101V - RES, THICK FILM, 1K1, 1%, 0.25W, 1206

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ERJ8ENF1101V - Panasonic - PCB symbol
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PCB Footprints
ERJ8ENF1101V - Panasonic PCB footprint - Other - Other - ERJ8EN
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3D Models
ERJ8ENF1101V - Panasonic - 3D model - Other - ERJ8EN
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ERJ8ENF1101V Details

  • Manufacturer Part Number:

    ERJ8ENF1101V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    1100 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF1101V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF1101V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1mm.
  • During reflow soldering, the ERJ8ENF1101V should be placed on a flat surface to prevent tombstoning. The component should be aligned with the PCB pads and the solder paste should be applied evenly. The recommended reflow temperature profile is 250°C for 10-30 seconds.
  • Yes, the ERJ8ENF1101V is suitable for high-frequency applications up to 1 GHz. However, it's recommended to use a suitable PCB layout and impedance matching to minimize signal loss and ensure optimal performance.
  • The ERJ8ENF1101V is rated for operation up to 125°C. However, it's recommended to derate the component's power rating and consider the thermal resistance of the PCB and surrounding components when operating in high-temperature environments.
  • To ensure the reliability of the ERJ8ENF1101V in a humid environment, it's recommended to apply a conformal coating to the PCB and follow proper storage and handling procedures to prevent moisture absorption. Additionally, the component should be soldered using a reliable soldering process to prevent whisker growth.

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ERJ8ENF1101V Overview

Use the download button to access the ERJ8ENF1101V schematic symbol, PCB footprint, and 3D model.
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ERJ8ENF1101V Alternates

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Part Image RGC1206FTD1K10 SEI Stackpole Electronics Inc

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