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ERJ8ENF1201V - Panasonic

Description: Thick Film 1206 resistor 1K20 250mW 1% Panasonic ERJ8EN Series Precision Thick Film Surface Mount Resistor 1206 Case 1.2kΩ ±1% 0.25W ±100ppm/°C

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ERJ8ENF1201V - Panasonic PCB footprint - Other - Other - ERJ8EN
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ERJ8ENF1201V - Panasonic  - 3D model - Other - ERJ8EN
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ERJ8ENF1201V Details

  • Manufacturer Part Number:

    ERJ8ENF1201V

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    CHIP

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Japan

  • ECCN Code:

    EAR99

  • HTS Code:

    8533.21.00.30

  • Factory Lead Time:

    22 Weeks

  • Manufacturer:

    Panasonic Electronic Components

  • YTEOL:

    3

  • Additional Feature:

    PRECISION

  • Construction:

    Rectangular

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    155 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    0.6 mm

  • Package Length:

    3.2 mm

  • Package Shape:

    RECTANGULAR PACKAGE

  • Package Style:

    SMT

  • Package Width:

    1.6 mm

  • Packing Method:

    TR, PUNCHED, 7 INCH

  • Rated Power Dissipation (P):

    0.25 W

  • Rated Temperature:

    70 °C

  • Reference Standard:

    AEC-Q200; IEC60115-8

  • Resistance:

    1200 Ω

  • Resistor Type:

    FIXED RESISTOR

  • Size Code:

    1206

  • Surface Mount:

    YES

  • Technology:

    METAL GLAZE/THICK FILM

  • Temperature Coefficient:

    100 ppm/°C

  • Terminal Finish:

    MATTE TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Tolerance:

    1%

  • Working Voltage:

    200 V

ERJ8ENF1201V Frequently Asked Questions (FAQs)

  • The recommended land pattern for ERJ8ENF1201V is a rectangular pad with a size of 1.3mm x 0.8mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a minimum clearance of 0.2mm from the component body.
  • During reflow soldering, the ERJ8ENF1201V should be placed on a flat, even surface to prevent warping or deformation. The component should be aligned with the PCB pads and secured with a gentle pressure to prevent movement during the soldering process. The recommended reflow temperature profile is 240°C ± 5°C for 30 seconds to 60 seconds.
  • The maximum power rating for ERJ8ENF1201V is 0.5W. Exceeding this power rating can cause the component to overheat, leading to reduced performance, reliability issues, or even failure.
  • While ERJ8ENF1201V is designed to be robust, it is not specifically designed for high-vibration environments. If you need to use it in such an environment, you should ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the vibrations. Additionally, you may need to consider using additional mechanical support or vibration-dampening materials to prevent component failure.
  • ERJ8ENF1201V components should be stored in a dry, cool place, away from direct sunlight and moisture. The components should be stored in their original packaging or in a similar anti-static package to prevent electrostatic discharge (ESD) damage. The storage temperature should be between -20°C and 40°C, and the humidity should be below 60%.

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ERJ8ENF1201V Overview

Use the download button to access the ERJ8ENF1201V schematic symbol, PCB footprint, and 3D model.
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Part Image WR12X1201FGL Walsin Technology Corporation

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Part Image CRG1206F1K2/10 TE Connectivity

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For a full list of alternate parts for ERJ8ENF1201V, check out Findchips.com